| 1. | The analysis of delamination and fracture in ic packages
湿热导致电子元件封装脱层断裂的分析 |
| 2. | Coplanarity problems of ic packaging
集成电路封装的共面性问题 |
| 3. | Design of motion control system with high speed and high precision positioning platform for ic package
面向芯片封装的高速精密定位平台控制系统设计 |
| 4. | At present , bga / csp is becoming the mainstream of the advanced ic package technology
目前微电子球栅阵列尺寸封装( bga csp )正成为高端ic封装的主流技术。 |
| 5. | Reinvest jingyang technology co . , ltd engaging in ic package , manufacture , test , and the components producing and selling
转投资晶扬科技股份有限公司，从事集成电路封装制造测试服务及其零组件加工销售 |
| 6. | Reinvest jingyang technology co . , ltd engaging in ic package , manufacture , test , and the components producing and selling
转投资晶扬科技股份有限公司，从事集成电路封装、制造、测试服务及其零组件加工销售 |
| 7. | First , the paper discusses briefly the ic package technology , the reliability analysis methodologies and the current situation of the ic package
本文首先对芯片封装及其可靠性分析方法及现状进行了概述，并对相关理论方法作了介绍。 |
| 8. | Manufactures metallized ceramic packages for rf microwave devices , multilayer ceramic and organic material ic packages and offers flip - chip , wire - bond semiconductor and electronic plating services
-一家专业研制生产销售系列高稳晶体振荡器和开关电源产品的高科技企业。 |
| 9. | It is not possible to join the two pins within the ic package because the analog part of the converter cannot tolerate the voltage resulting from the digital current flowing in the bond wire to the chip
（过去）无法在芯片内部将二者连接的原因是数字电流流经内部引线电阻产生过大的电压，芯片的模拟部分无法承受。 |
| 10. | It discusses not only a kind of new vacuum jointing process in ic packaging but also its theory and background . besides , it enumerates the remarkable achievements by implementing this process
摘要论述了在集成电路生产中一种新的真空烧结工艺，讨论了它的理论依据及产生背景，并列举了通过实行该工艺所带来的显著成绩。 |
